AUSTIN, Texas, Nov. 16, 2008 - More supercomputers than ever are using Intel Corporation processors, according to the latest TOP500 list. The high performance computing (HPC) community is especially enthusiastic about quad-core Intel® Xeon® processors which are driving the research and analytical capabilities of more than half the systems on the list. The 32nd edition of the TOP500 list shows that 379 of the world's top 500 systems, including the third-fastest system in the world, now have Intel inside. According to the list, Intel is powering 49 systems in the top 100. Systems using Intel® Xeon® quad-core processors dominate the list, holding 288 spots. Using reinvented high-k metal gate transistors, Intel's year-old quad-core 45nm Intel® Xeon® processor 5400 series is used in 222 systems, including 32 powered by low voltage variants. Intel-based super computing platforms are playing a pivotal role in a number of research areas, from improving the safety of space exploration to forecasting global climate conditions. More "mainstream" industries, such as financial services and health care, are also using Intel-based systems to achieve faster, more accurate results, to speed the pace of innovation and improve competitive advantage. In addition to hardware, Intel is delivering to the HPC community a wide range of software tools, including compilers and MPI libraries, which help customers maximize multicore processing and improve the efficiency of clustered solutions. Approximately 75 percent of systems in the Top500 are using Intel software tools. "We're proud that Intel processors and software tools are playing a significant role in driving the world's most important scientific research and advancements," said Kirk Skaugen, vice president and general manager of Intel's Server Platforms Group. "With our multi-core innovation powering so many systems on the TOP500, it's clear that Intel is committed to pushing the boundaries of supercomputing." Over the past year, Intel has gained significant momentum in high-performance computing, signaled by major collaborations with Cray Supercomputer and NASA. Intel and Cray plan to develop a range of HPC systems and technologies driven by multi-core processing and advanced interconnects. Meanwhile, Intel, SGI and NASA are collaborating on Pleiades, a super computing project which is the No. 3 system on the list, and will enable groundbreaking scientific discovery with a goal of reaching 1 PetaFLOPS in 2009, and 10 PetaFLOPS (or 10,000 trillion operations per second) by 2012. The semi-annual TOP500 list of supercomputers is the work of Hans Meuer of the University of Mannheim, Erich Strohmaier and Horst Simon of the U.S. Department of Energy's National Energy Research Scientific Computing Center, and Jack Dongarra of the University of Tennessee. The complete report is available at www.top500.org.
Putting Intel's Moorestown chip package inside a future version of the iPhone would make the smart phone less secure, according to an independent security researcher. "That will make the iPhone x86 and that will make a lot of attacks easier," said Dino Dai Zovi, an independent security researcher, in an interview at the Hack In The Box security conference in Kuala Lumpur, Malaysia. Due for release in 2009 or 2010, Moorestown is a chip package designed for smart phones and other handheld computers. The heart of the package is an upcoming version of Intel's Atom's processor, an inexpensive low-power x86 processor. Apple has never said it intends to use Moorestown in future products, but Intel is widely believed to be hopeful that Apple will adopt the chip package. "The iPhone uses the Arm processor and most people are not familiar with it," Dai Zovi said, noting that x86 processors are familiar territory for malware writers and hackers looking for vulnerabilities. "If you're doing exploits and vulnerability research, you need to know the specifics of the processor that's running," he said. Dai Zovi is a well-recognized figure in computer security circles and is widely known for winning a 2007 hacking contest that involved hacking into a MacBook Pro laptop. The feat by Dai Zovi and partner Shane Macaulay won them the MacBook Pro as well as a US$10,000 prize, and laid to rest popular misconceptions that MacOS X was somehow immune from the type of security vulnerabilities that affect Windows-based computers. Intel executives declined to comment on Dai Zovi's remarks, saying any discussion of a Moorestown-based iPhone is purely hypothetical. In addition, they said Intel's policy is to decline comment on other companies' products. MacOS X is seen as generally safer than Windows, because the small market share of MacOS X means most malware writers and hackers choose to focus their efforts on Windows instead. But that could change as iPhone sales boost the number of MacOS X users. "The iPhone is another OS X platform and whereas now the market share for OS X is definitely under 10 percent on desktops, on smart phones they recently sold more phones than RIM," Dai Zovi said, referring to the maker of the BlackBerry line of handheld devices. The iPhone runs a slimmed-down version of MacOS X, the operating system used in Apple's desktop and laptop computers. As a result, some of the security features that are included in the desktop version of MacOS X are not included in the phone version. "The iPhone is significantly less secure than the desktop version of OS X," Dai Zovi said. Reference : http://www.pcworld.com/article/153111/.html?tk=rss_news
The Tubes are atwitter with discussion of the news from PDC this week, not least of which was the announcement of Microsoft's new Windows Azure cloud computing platform. Details about the offering remain scant at this point -- the SDKs and developer programs are "by invitation only" -- but what I've heard so far sounds promising. I'm particularly interested in Live Services, which finally lifts the lid off the inner workings of Live Mesh (of which I am a devoted user). But while I'm fairly rah-rah about the potential of cloud computing platforms in theory, I remain skeptical about their efficacy for enterprise software development in practice. By comparison, Microsoft is nothing if not gung-ho. Where Amazon and Google have tread carefully, unveiling their cloud services first as pilot programs with limited applications, Microsoft seems determined to deliver its version of the cloud to its entire ISV community on a plate. While the geek in me is itching to play around with this stuff, my instinct says "caution." Let's dispense with the "Microsoft is evil" argument for the moment: Who wants to get in bed with Microsoft for something like this? Windows developers, that's who. You Microsoft ISV partners out there all recognize that a certain amount of vendor lock-in goes with the territory. It might be nice not to have to keep that revenue stream going from your accounts into Microsoft's, but for you the benefits outweigh the costs -- and the risks. And if you think about it, who makes for a better cloud-computing partner than Microsoft? They're already expanding their datacenters, up there in Redmond, to support the new hosted platforms. That's exactly the kind of thing you want from a cloud vendor. Microsoft reaches into its deep pockets so you don't have to have deep pockets of your own. So what if your applications will be tied to Microsoft's services and APIs? For Windows developers that's true already. I believe, however, that the kind of lock-in you get with a cloud-computing service is different than the lock-in you get with the Windows developer ecosystem as it exists today. For the sake of argument, let's suppose that you have developed a traditional Windows application for your business. One day, Microsoft releases a new version of a key framework, and the updated API breaks some of your code. You now have several options. One is to rewrite your code, introducing a certain amount of cost and risk. Another option is to do nothing, and continue to run your software with the older version of the framework. That will doubtless work for a while, but eventually the older framework might not work with a new version of Windows, or even a new Service Pack. These sorts of compatibility issues are a fact of life with all forms of software. The important thing is that they are always manageable. Even if you have to find an aging MS-DOS computer to run your legacy code, that is still an option -- for a while, at least. But where are you going to find an old version of the Microsoft's cloud computing platform to run your legacy Windows Azure code? With the cloud computing model, when you buy a ticket, you're in for the ride. When Microsoft says it's time to update your code to suit the latest version of its platform, you'd better do it. Think that kind of thing won't happen? I believe it's more than likely, particularly as the market for cloud-computing services heats up. Let's suppose that tomorrow some clever graduate student comes up with a way to scale cloud services more cheaply and effectively than any other method before. Do you think Microsoft will ignore this method if it thinks it needs it to stay competitive? Even if all of its customers will have to adjust their code to work with the new method, do you think Microsoft will be deterred? Cloud computing environments create a whole new kind of developer partner. In traditional ISV relationships, the customer pays the fees for the necessary tools and then the sky is the limit. With cloud computing, the customer's capabilities are directly influenced by the vendor's bottom line. If the vendor decides it can no longer afford to provide certain services -- or service levels, or security, or guarantees of privacy -- then henceforth that will be the new deal. My nightmare scenario is that we'll end up with application hosting services offered up on the same terms as credit cards. Every few months, a slim brochure will arrive in the mail explaining the new terms and what we'll need to do to remain in the program. Even if it never comes to that, the fact that the vendor has its hand on the on/off switch is what makes the cloud computing model seem so troubling. The day that the vendor -- be it Microsoft or anyone else -- decides that your applications are no longer going to run on its platform is the day that they stop running, period. If you raised an eyebrow at the revelation that Google has reserved the option to terminate applications running on Android phones remotely, this fact of life of cloud computing should give you even more pause. OK, so I can't keep you from harping on Microsoft forever. I'm sure some of you are already itching to say, "It's Microsoft, what do you expect?" But my question is this: Given these realities, just what cloud computing vendor would you trust to host your apps? Reference : http://www.pcworld.com/article/153063/cloud_computing_azure.html?tk=rss_news
Dell planned to refresh its line of Optiplex desktops on Tuesday with 10 new models, including a thin-client computer based on Intel's Atom processor. The company will also expand the availability of its Flexible Computing and Managed Desktop services, now available in the U.S., to customers in other markets. Dell's latest products arrive at a difficult time, with markets roiled by fears of a global recession and companies cutting back on expenses in the face of expected weaker demand. Dell isn't immune. The company warned last month that end-user demand had softened in the U.S., as well as in parts of Europe and Asia. But Dell said its latest products can help companies cut their IT costs -- provided companies are willing to invest capital in new computers. "These machines do consume less power than what's out there in the infrastructure today. With depreciation cycles of four or five years, those aging desktop machines out there are costing customers more money," said Jeff Clarke, senior vice president of Dell's Business Product Group, in a phone interview. The updated Optiplex range and the broader availability of Dell's Flexible Computing and Managed Desktop services reflects Dell's desire to offer its customers more than just hardware. "It's a signal of where Dell is going, this notion of hardware, software and services integrated together to bring a solution to the market place," Clarke said. The Atom-based Optiplex FX160 thin client is priced starting from US$399 and was designed to complement Dell services, like its On-Demand Desktop Streaming offering for customers. The FX160 gives customers another option when deciding how they want to run their systems, Clarke said, adding that Dell has long sold third-party thin clients to its customers. "We really believe in flexibility and not coming in and saying that the only way to do it is have a virtual client, or the only way to do it is a thin client," he said. The Atom's capabilities are well suited to a thin client, where the horsepower of Intel's mainstream processors aren't necessary. "The types of applications that are being deployed in call centers and point-of-sale locations are very single, or in some cases dual, application-based and the Atom processor has sufficient horsepower to do one or two applications in parallel," Clarke said. Introduced in June, Atom has been a runaway success and Intel has worked hard to keep pace with fast-growing demand, leading some computer makers to grumble about product shortages. But Dell won't face that problem. "I won't have a supply issue," he said. Besides the FX160, other models in the new desktop lineup include the Optiplex 960, 760 and 360. These systems will be available in a range of form factors and are priced starting from $863, $593 and $476, respectively. Reference : http://www.pcworld.com/article/152910/.html?tk=rss_news
The first netbook-type portable computer from Toshiba hit store shelves in Japan over the weekend, ahead of its upcoming launch in Europe. U.S. sales are currently not planned for the machine. Like many other netbooks the NB100 is based on a 1.6GHz Intel Atom processor and has an 8.9-inch display with 1,024 pixel by 600 pixel resolution (WSVGA). The machine measures 22.5 centimeters by 19.1cm by 3.3cm. It weighs just over 1 kilogram and battery life is 2.9 hours, according to Toshiba. In Japan a single version is available, running Windows XP Home and with a 120G-byte hard-disk drive, wireless LAN and Bluetooth. Store prices for the machine range from ¥63,800 to ¥69,800 (US$677 to $740), according to price comparison site Kakaku.com. At one Tokyo electronics store on Monday the machine was being offered for as low as ¥24,800 if customers signed up for cellular data service. European models will be offered with up to 160G-byte hard-disk drives on Windows XP models. Versions based on Ubuntu Linux are also planned, although they'll have half the memory of the Windows versions and a maximum hard disk size of 120G-bytes. They also won't support Bluetooth. Pricing for these overseas models and launch dates are yet to be announced by Toshiba. However, European online electronics stores are already listing variations of the computer at prices between €366 and €403 (US$461 and $508). Reference : http://www.pcworld.com/article/152851/.html?tk=rss_news
Epson on Thursday introduced its newest 24-inch and 44-inch Stylus Pro inkjets. The Stylus Pro 7900 and Stylus Pro 9900 cost US$3,995 and $5,995, respectively, and will be available in November. Designed for reprographic professionals and photographers looking to output large-format content, the new printers feature Epson's MicroPiezo TFP print heads with UltraChrome HDR ink. An optional in-line spectrophotometer can manage color in a printing workflow. The printers feature a maximum resolution of 2880 x 1440 dots per inch (DPI) resolution with variable-sized droplets as small as 3.5 picoliters. Both Photo and Matte Black ink cartridges are used, depending on the media. The printers can handle "any media type," according to Epson, roll or cut sheet, up to 24 and 44 inches wide using a straight-through media path. Epson also touts the printers' media loading technology, which simplifies the roll and cut-sheet media loading process. Rotary cutters can cut canvas and fine art papers. The printers feature 11 individual ink cartridges, which come in 150, 350 and 700 ml capacities. And both printers also have 2.5-inch color LCD displays. Reference : http://www.pcworld.com/article/152698/.html?tk=rss_news
Epson's WorkForce GT-1500 is a color document scanner designed to simplify the tedious task of scanning stacks of text documents in an office environment. Easy to use and simple in its focus, the GT-1500 does an adequate job of photo- and document-scanning. The GT-1500 can quickly scan multiple sheets at a time thanks to an automatic document feeder (ADF) capable of holding as many as 40 sheets, as large as 8.5 by 14 inches. Although you're limited to a maximum scanning resolution of 600 dpi when using the ADF, the benefits of having an ADF are clear: Imagine having to scan a 40-page document manually-opening the lid and aligning each sheet of paper individually. That could take an hour, and if it's a task that's part of your regular work routine, those hours add up quickly. With the GT-1500, it takes only 40 seconds to scan ten pages and roughly three minutes for 40 pages. It's easy to scan documents and use the included Epson software to tweak the scans before you save to one of several file formats, including PDF. However, we found the included Abbyy FineReader Sprint Plus OCR software could turn TIFF files into text files, but it could only process one page at a time, rendering the ADF useless. Alternatively, you can batch scan documents as TIFF files using the EpsonScan software then process them individually afterward using the OCR software-but that's hardly convenient. This is not a scanner meant for anyone looking to scan stacks of photos. The high-speed ADF is designed for text documents; photo-, transparency-, and slide-scanning are eschewed for a focus on multi-page documents and speed. Unfortunately, the GT-1500 can't scan both sides of a document in one pass as can the more expensive ScanSnap S510M. Both scanners can handle documents as large as 8.5-by-14-inches, and both can scan on average about 18 pages per minute. But the ScanSnap can scan both sides of a page in the same amount of time it takes the GT-1500 to scan one side. If you have lots of double-sided documents, the ScanSnap is the better choice. The scanner turned in some fast scanning times. As we mentioned earlier, the GT-1500 took 40 seconds to scan a ten-page single-sided text document. A scan of an 8-by-10 photo at 600 dpi and 24-bit color depth took only 35 seconds on average, about ten seconds faster than recently reviewed flatbed scanners such as Microtek's ArtixScan M1 Pro. It took an additional 7 seconds for the same photo to scan when set at 48-bit color scanning. Our 4-by-6 photo scan test (set at 1,200 dpi) was equally impressive with both our 24- and 48-bit color scans taking about 60 to 70 seconds on average. We also found that the GT-1500 required almost no warm-up time, thanks to Epson's ReadyScan LED technology, which eliminates the need to warm up the internal lamp. Although the GT-1500 is clearly designed to handle large volumes of documents, it does prove up to the task of handling photo-scanning as well. Both our grayscale and color photo-scans achieved Very Good image-quality rankings in our jury test, based on their strong color and high levels of detail. In fact, when compared with the photo-centric Epson Perfection V300 Photo, we found that both produced similar-quality scans. Macworld's buying advice The WorkForce GT-1500 is Epson's answer to the growing need in small businesses for a fast document-focused scanner that can scan multiple pages of text in short order. The results with photos weren't disappointing either, making the scanner more versatile than we expected. Unless you require film- and slide-scanning capabilities, this could be the scanner your home or office needs to eliminate those growing stacks of paper. However, if you're looking for a scanner purely dedicated to document-scanning and capable of handling double-sided documents, take a look at the ScanSnap S510M. Reference : http://www.pcworld.com/article/152693/.html?tk=rss_news
Switch Vendors Can Reach a Broader Set of Clients with a Single Product ARMONK, NY and SANTA CLARA, Calif. -- October 23, 2008 -- IBM and Intel Corporation today announced they are extending their collaboration in the blade server market to drive adoption of an open industry specification for blade switches. This will enable switch vendors to maximize return on their research and development by developing products to a single design, reaching more customers with just one product. Switches are essential components of every blade system, channeling data to and from the server. As part of the agreement announced today, IBM will extend the BladeCenter switch specification for blade servers to the Server Systems Infrastructure (SSI) organization on a royalty-free basis, allowing switch vendors to create one product that works across the BladeCenter and SSI ecosystems and driving more switch products for clients to choose from. The companies also announced plans to work together to establish a third-party Switch Compliance Lab, where the developer community can test and verify their blade server products for BladeCenter and SSI environments. The announcement today builds upon a history of IBM and Intel collaboration on blade technology -- starting in 2002 with the development of the first BladeCenter servers and continuing in 2006 when IBM, Intel and other industry leaders formed Blade.org, the industry consortium driving open innovation in blade-based solutions that today has over 200 members. SSI is an industry organization established over 10 years ago to enable server builders to develop compliant and interoperable building blocks for blade, chassis and manageability software technology. The incorporation of the open switch specification into SSI is intended to broaden the market for switch module vendors as they collaborate on SSI-specified blade switch solutions with Intel and IBM. In this segment, Blade Network Technologies, Brocade, NextIO and others have committed their support for the open specification. By extending its switch specification and ecosystem to affiliated members of SSI, IBM is driving greater adoption of BladeCenter-compatible switches. "The extension of the BladeCenter switch specification and ecosystem to SSI advances open specifications for blade systems," says Alex Yost, vice president of IBM BladeCenter. "Making the switch design in our open BladeCenter specification available to a broader set of vendors demonstrates IBM's commitment to foster openness in the blade server market." Demand for a common switch specification comes at a time when blade servers are becoming a critical ingredient in IT infrastructure. The availability of the open BladeCenter switch specification to SSI members allows them access to the more than 25 specification-compliant switches on the market today. "By working with IBM, we have expanded ecosystem support for SSI blade specifications to over 70 vendors," says Kirk Skaugen, General Manager, Server Platforms Group, Intel. "Continued IBM and Intel collaboration will go further to expanding the entire blade server market. This is good for customers who will benefit from increased choice from a breadth of server, networking and storage vendors while enabling each product to maximize return on the R&D invested." Reference : http://www.intel.com/pressroom/archive/releases/20081023comp.htm?cid=rss-90004-c1-216989
The next time Apple will have the opportunity to boost the processor specifications of its MacBook Pro line will be next spring, when Intel pushes out a final update to its Montevina platform consisting of two high-performance mobile chips, according to reports.Apple's current MacBook Pros employ a "P" series, medium voltage (25W) P8600 2.4GHz chip at the low end, and a "T" series, standard voltage (35W) T9400 2.53GHz chip at the high end. The T series chip costs the company roughly $32 less than the P series, according to pricing estimates published on the web, but runs slightly hotter. Apple also offers a build-to-order option on the MacBook Pro that lets customers choose a "T" series, standard voltage (35W) T9600 2.8GHz chip for a $300 premium. The chip costs the company roughly $200 to $250 more than the 2.53GHz variants, according to estimates.Citing sources at Taiwanese notebook makers, DigiTimes claims Intel will refresh these Montevina-based Core 2 Duo offerings in April by adding two new variants: a P8800 running at 2.66GHz and a T9900 clocking in at 3.06GHz. VR-Zone earlier in the week provided corroborating evidence to this end via a series of leaked Intel roadmap presentation slides. The visuals list the two chips as arriving anytime from mid-to-late second quarter, which runs April through June. At this juncture, Apple could presumably bump its 15-inch MacBook Pro configurations up to standard frequencies as high as 2.66GHz and 2.8GHz, with a 3.06GHz build-to-order option. Alternatively, it could inch standard configurations up to 2.53GHz and 2.66GHz, leaving the 2.8GHz and 3.06GHz chips as potential build-to-order choices. It should be noted, however, the 17-inch unibody MacBook Pro should be in the mix by this time, potentially adopting one of the remaining high-end chips, such as the 2.8GHz. The current array of Intel Core 2 Duo mobile chips employed in Apple's unibody MacBook Pros.The spring refresh is expected to be the last to hit Intel's Montevina platform before the chipmaker turns to its new and broad Nehalem architecture, which has since officially been dubbed the " Core i7." Calpella is the code-name for Intel's Core i7-based mobile platform, which will umbrella chips currently referenced by the "Clarksfield" code-name (the same way that Montevina umbrellas mobile chips from the Penryn family). [Dizzy yet?] Spring 2009 Core 2 Duo mobile chip additions likely to be adopted by Apple's MacBook Pros.With the launch of Calpella not scheduled until the third quarter of 2009 at the earliest, few if any hard specifications are known about its new mobile chips. More generally, however, it's been speculated that Calpella processors will be based on a 32-nanometer manufacturing process and possibly abandon the use of separate northbridge and southbridge chipsets for components that will be integrated into some of its processor families. A bit earlier next year, Intel also plans to introduce its new GM47 integrated graphics chipset with a 1066MHz front-side bus and 640MHz graphics core frequency. Given Apple's emphatic endorsement of NVIDIA's new chipsets across its notebook lines, it's unlikely the company holds any plans to adopt the new Intel part.Update: Charts and story text updated to reflect confirmation that the 2.53GHz Intel processor employed by the unibody MacBook Pro is the "T" series, standard voltage (35W) T9400, and that Apple is not using the "P" series, medium voltage (25W) P9500. Reference : http://www.appleinsider.com/articles/08/10/23/future_macbook_pro_bound_intel_chips_due_next_spring.html
Intel on Monday showed off a prototype handheld based on Moorestown, its upcoming Mobile Internet Device (MID) platform designed to enable a new generation of ultra-thin, touchscreen devices with extensive battery life.Presenting at the Intel Developer Forum in Taipei, Intel vice president Anand Chandrasekher said Moorestown will consist of a system-on-a-chip (SOC), codenamed "Lincroft," which integrates a 45nm processor, graphics, memory controller and video encode/decode onto a single part. The chip will connect to a southbridge I/O hub codenamed "Langwell", which supports a range of I/O ports to connect with wireless, storage, and display components in addition to incorporating several board level functions. When it arrives sometime in the 2009-2010 time, the Moorestown platform will introduce a more than tenfold reduction in idle power consumption when compared to Intel's first-generation MIDs based on the Intel Atom processor, Chandrasekher said.Intel is targeting Moorestown at the smartphone space, claiming the technology will serve as a catalyst for new developments that will extend the full Internet experience into into a new generation of handsets with advanced wireless communications. The platform will support a range of wireless technologies including 3G, WiMAX, WiFi, GPS, Bluetooth and mobile TV. Chandrasekher said Intel is collaborating with both Ericsson and Option on new 3G HSPA data modules that will come in 25x30x2.x mm small size and provide an "always connected" Internet-based experience.In the videos below, the Intel exec can bee seen demonstrating the first working Moorestown-based handheld, which Engadget claims is "little more than a validation board running fresh from the factory, three-dayold Moorestown silicon in an Intel lab." A similar device had been flaunted by the chipmaker in recent years, though those versions are said to have been non-functional mockups. At one point, it was reported that Apple would embrace Intel's MID platform as the foundation for its own next-generation mobile Internet device, sometimes referred to as a next-generation Newton handheld or Internet tablet. Intel's vision of a next-generation mobile Internet device looks something like this.However, the company's recent acquisition of chip designer PA Semi to build proprietary ARM chips for iPhones and iPods may signal a change of direction on the part of the electronics maker. Reference : http://www.appleinsider.com/articles/08/10/20/intel_shows_off_working_moorestown_mid_device.html
HP today announced two new consumer desktop PCs and a color display designed to have reduced impact on the environment. The HP Pavilion Verde Special Edition a6645f and HP Pavilion Phoenix Special Edition a6655f desktop PCs include AMD® energy-efficient processors(1,2) and recyclable packaging. The 25.5-inch HP w2558hc Vivid Color Display offers a wide range of new features, including a built-in webcam and 15-in-1 card reader, for enhanced entertainment and connectivity.(3) In addition, HP updated the HP Compaq Presario, HP Pavilion, HP Pavilion Slimline and HP Pavilion Elite lines of desktop PCs with new configurations to fit the needs of every consumer – from entertainment enthusiasts to budget-minded families and students. More information about the new lines is available at HP Direct. PCs designed with the environment in mind The HP Pavilion Verde Special Edition a6645f and HP Pavilion Phoenix Special Edition a6655f desktop PCs are ENERGY STAR® qualified and meet the standards for Silver registration in the Electronic Products Environmental Assessment Tool (EPEAT™). The special-edition desktop PCs are designed with AMD energy-efficient processors(1,2) and advanced power management features that provide up to 45 percent energy savings compared to PCs without power management enabled. In addition, they come in 100 percent recyclable packaging with less plastic foam. “The Phoenix and Verde desktops represent HP’s ongoing efforts to innovate and design for the environment,” said John Cook, vice president, Marketing, Worldwide Consumer PC Business, HP. “HP is committed to offering consumers and businesses computing alternatives that can reduce energy consumption and lessen their overall eco-footprint.” The special-edition desktop PCs offer up to five gigabytes (GB) of memory, Windows Vista® Home Premium 64-bit edition with Service Pack 1,(4) a front-panel 15-in-1 memory card reader for easily transferring photos and files to and from peripheral devices, and a SuperMulti DVD burner with LightScribe technology for etching custom labels and artwork directly onto discs.(5) The HP Pavilion Phoenix Special Edition a6655f desktop PC includes an energy-efficient AMD Phenom™ X4 9150e Quad-Core Processor(1) and 640 GB hard drive(6) and features a stunning design symbolizing the mythical phoenix. The HP Pavilion Verde Special Edition a6645f desktop PC has a nature-inspired pattern on the chassis and includes an energy-efficient AMD Athlon™ X2 4850e Dual-Core Processor(2) and 500 GB hard drive.(6) Introducing a display that does it all HP’s new 25.5-inch diagonal widescreen flat panel display contains an array of features to provide enhanced entertainment, connectivity and performance. The elegant, ergonomically designed HP w2558hc Vivid Color Display includes a built-in 15-in-1 card reader for easily viewing slideshows and videos, even when the PC is turned off, as well as a built-in two-megapixel webcam for staying connected with friends and family through video chat.(7) The HP w2558hc also has multiple USB ports and digital outputs to provide convenient connectivity to external devices, such as MP3 players and digital cameras.(8) HDMI inputs allow for a high-definition experience,(9) delivering bright and brilliant images powered by a fast response time, high brightness and contrast ratio, and BrightView technology. The ergonomic design of the HP w2558hc with built-in speakers and a slim profile fits easily in the home and helps minimize desk space use. The display also includes height and tilt adjustments to suit viewing needs. The HP w2558hc is ENERGY STAR qualified and offers a Power Saver feature to help reduce energy consumption. Pricing and availability(10) The HP Pavilion Verde Special Edition a6645f Desktop PC is expected to be available Nov. 9 exclusively through Circuit City, starting at $579. The HP Pavilion Phoenix Special Edition a6655f Desktop PC is expected to be available Nov. 9 exclusively through Best Buy, starting $659. The HP w2558hc display is currently available through HP Direct and select retailers nationwide starting at $599. Reference : http://www.hp.com/hpinfo/newsroom/press/2008/081020xa.html?mtxs=rss-corp-news
HP today unveiled renewable energy initiatives in its facilities, research and products to support a new goal to double the company’s global purchases of renewable power from under 4 percent in 2008 to 8 percent by 2012. This complements HP’s goal to reduce energy consumption and the resulting greenhouse gas emissions from HP-owned and HP-leased facilities worldwide to 16 percent below 2005 levels by 2010. To reduce its carbon footprint, HP is relying on diversified renewable energy resources, improving energy efficiency and placing a strong emphasis on energy reduction and optimization at a number of its facilities around the world. In 2007, HP successfully met its goal to increase renewable energy purchases by more than 350 percent and purchased 61.4 million kilowatt hours (kwh) of renewable energy and renewable energy credits in the United States. “HP is investing in technologies that bring us closer to operating in a sustainable IT ecosystem,” said John Frey, senior sustainability executive, HP. “We are supporting renewable energy programs for our own operational efficiency, harnessing research to demonstrate environmental leadership and offering products that support customer concerns about rising energy costs.” Harnessing solar and wind power HP recently completed a 1.1-megawatt, 6,256 solar panel system at its facility in San Diego. This is one of the largest solar power installations in the County of San Diego and is projected to save the company $750,000 during the next 15 years while providing more than 10 percent of the facility’s power. Further, the system will reduce carbon dioxide emissions by more than 60 million pounds over the next 30 years. This is equivalent to providing electricity to 3,800 homes or removing more than 5,250 cars from the road over this time period. SunPower installed the system and GE Energy Financial Services, a unit of GE that owns the system under SunPower Access, will provide the electricity under a power purchase agreement. HP also extended the benefits of solar power to its U.S. employees. To date, more than 600 HP employees and retirees have requested an evaluation of a home system installation, and more than 60 have completed an installation or are under contract to install SunPower systems at their homes. HP elected to participate in Austin’s Green Choice program, to procure almost 19.9 million kwh of wind energy from wind farms in western Texas for two of its Austin data centers, which represents nearly 20 percent of the annual energy used by the two centers. Additionally, the facilities are using the HP Dynamic Smart Cooling (DSC) system, which enables real-time changes to air conditioners, fans, vents and computing equipment help reduce carbon dioxide emissions and reduce energy costs. HP DSC typically yields energy savings of 20 to 40 percent over legacy HP data centers. HP’s Austin data centers are on track to achieve energy cost savings of more than $100,000 annually based on the integration of HP DSC technology. HP consolidated three of its facilities in Melbourne, Australia, with sustainability in mind. The new facility design included orienting the building to strategically reduce energy consumption associated with heating and cooling and using energy-efficient lighting. As a result, HP expects to reduce energy consumption and carbon emissions by 70 percent. Sustainable IT ecosystem HP is leveraging renewable and non-renewable resources to effectively and efficiently manage a limited supply of available energy. The use of various sources of power throughout its operations will support the development of HP’s micro-grid for power and cooling distribution in the data center facility, which ensures efficiency, manageability and regulatory requirements while meeting service level agreements. HP Labs, the company’s central research arm, has initiated research that uses nanowire photonics to potentially increase the efficiency of solar cells to more than 20 percent. This development allows solar cells to operate on a level of those used in expensive deep-space applications, while being manufactured at much lower costs, like those used in pocket calculators or to recharge portable devices. Nanowire photonics may be integrated with a greater selection of conductor materials, allowing for low-cost options. In the future, nanowire photonics may optimize renewable energy throughout the IT industry and other business sectors. Taking steps to reduce the energy required for manufacturing and distributing products, HP plans to reduce the energy consumption of its volume desktop and notebook PC families by 25 percent, relative to 2005. Today, HP announced two new desktop PCs and a display designed to have reduced impact on the environment with energy-efficient processors and recyclable packaging. The HP Pavilion Verde Special Edition a6645f and HP Pavilion Phoenix Special Edition a6655f desktop PCs are ENERGY STAR® qualified and meet strict energy-efficiency guidelines set by the U.S. Environmental Protection Agency. The products also meet the standards for the Silver registration in the Electronic Products Environmental Assessment Tool (EPEAT™), one of the highest ratings products can achieve for their environmental attributes. In addition, HP announced the ergonomically designed 25.5-inch HP w2558hc Vivid Color display, which is ENERGY STAR qualified and offers a Power Saver feature that helps to reduce energy consumption. The special-edition desktop PCs provide up to 45 percent energy savings compared to PCs without power management enabled and come in 100 percent recyclable packaging with less plastic foam. HP and the environment For decades HP has been an environmental leader, driving company stewardship through its holistic design for environment strategy. HP influences industry action through its long-standing commitment to maintain supply chain responsibility, sustain energy efficient operations, reduce its climate impact and offer product reuse and recycling options. HP also makes it easier for customers to recognize environmental attributes through HP Eco Solutions, a program that helps customers identify products and services designed with the environment in mind. More information is available at www.hp.com/environment. Reference : http://www.hp.com/hpinfo/newsroom/press/2008/081020a.html?mtxs=rss-corp-news
Intel is gearing up to release the first versions of its Nehalem chip family next month, with the scheduled launch of its Core i7 desktop processors. But users will have to wait much longer to get their hands on the mobile version of the new chip.The mobile version of Nehalem, codenamed Clarksfield, will “be in production beginning in the second half of 2009,” Intel said on Monday, without saying when the chips would be available commercially. The company did not elaborate on whether the reference to production means full volume production or limited pilot production of the processors. Either way, this production schedule suggests users may not see Clarksfield until late next year. Clarksfield will be produced using the same 45-nanometer production process that’s used to make Intel’s current chip lineup. The upcoming chip will be at the heart of the next version of Intel’s Centrino laptop chip package, called Calpella. Nehalem uses a different chip design than any of Intel’s current processors. The most significant improvement is the move to combine the processor with the memory controller hub, which connects the processor to main memory, on a single piece of silicon. This feature, which is already available on processors from rival Advanced Micro Devices, should offer much faster access to data than is possible with Intel’s current chips. Clarksfield is also expected to include more advanced power-management features than Intel’s current mobile chips. Reference : http://www.macworld.com/article/136223/2008/10/nehalem.html?lsrc=rss_main
Intel showed a short video of the first working Moorestown chips to come out of its factories at the Intel Developer Forum in Taipei on Monday. The video, which said the chips were three days old, showed a validation board with the chips running in an Intel lab and was played during a keynote speech by Anand Chandrasekher, senior vice president and general manager of Intel's Ultra Mobility Group. Moorestown is designed for handheld, portable computers that Intel calls Mobile Internet Devices (MIDs). The platform consists of Lincroft, a system-on-chip built around an Atom processor core, and the Langwell chipset, as well as optional modules for WiMax and high-speed cellular access. The chips are expected to consume significantly less power than Intel's current Atom chips designed for MIDs. Intel plans to release Moorestown during late 2009 or 2010. Reference : http://www.pcworld.com/article/152474/.html?tk=rss_news
Intel is gearing up to release the first versions of its Nehalem chip family next month, with the scheduled launch of its Core i7 desktop processors. But users will have to wait much longer to get their hands on the mobile version of the new chip. The mobile version of Nehalem, codenamed Clarksfield, will "be in production beginning in the second half of 2009," Intel said on Monday, without saying when the chips would be available commercially. The company did not elaborate on whether the reference to production means full volume production or limited pilot production of the processors. Either way, this production schedule suggests users may not see Clarksfield until late next year. Clarksfield will be produced using the same 45-nanometer production process that's used to make Intel's current chip lineup. The upcoming chip will be at the heart of the next version of Intel's Centrino laptop chip package, called Calpella. Nehalem uses a different chip design than any of Intel's current processors. The most significant improvement is the move to combine the processor with the memory controller hub, which connects the processor to main memory, on a single piece of silicon. This feature, which is already available on processors from rival Advanced Micro Devices, should offer much faster access to data than is possible with Intel's current chips. Clarksfield is also expected to include more advanced power-management features than Intel's current mobile chips. Reference : http://www.pcworld.com/article/152473/.html?tk=rss_news
Intel's upcoming Moorestown chip platform will include optional support for high-speed cellular data services when it hits the market in 2009 or 2010, Intel said Monday. Moorestown will be based on Lincroft, a system-on-chip that includes an Atom processor core and a memory controller hub, and a chipset called Langwell. Designed for small, handheld computers that Intel calls Mobile Internet Devices, Moorestown will offer optional support for both WiMax and HSPA (High Speed Packet Access) cellular networks. Intel is heavily pushing WiMax, which it sees as the best option for future wireless broadband services. But WiMax availability is very limited and it will take time for networks to enter commercial operation and expand their coverage areas. The addition of HSPA support to Moorestown hints that Intel recognizes that WiMax may not be extensively deployed as quickly as it would like, and users will want an alternative way of connecting wirelessly outside of Wi-Fi hotspots. This isn't the first time Intel has flirted with offering 3G (third generation telephony) support to computers. In 2007, the company shelved an agreement with Nokia to provide 3G modules for Centrino laptops, saying customer interest in the technology was lukewarm. That appears to be changing. At the Intel Developer Forum in San Francisco during August, Belgium's Option showed off HSPA modules it developed for MIDs based on Intel's Atom. On Monday, Intel announced that Option and telecom equipment maker Ericsson will make low-power HSPA modules that will be offered as an option with Moorestown. Intel is making its own WiMax module for Moorestown. The module, code named Evans Peak, made an appearance at the Ceatec show in Japan during late September. Reference : http://www.pcworld.com/article/152472/.html?tk=rss_news
SANTA CLARA, Calif., Sept. 15, 2008 – Intel Corporation has extended its lead in the high-end server segment, setting new standards in virtualization performance with the launch of seven 45 nanometer (nm)-manufactured Intel® Xeon® Processor 7400 Series products. With up to six processing cores per chip and 16MB of shared cache memory, applications built for virtualized environments and data demanding workloads, such as databases, business intelligence, enterprise resource planning and server consolidation, experience dramatic performance increases of almost 50 percent in some cases. Platforms based on these processors can scale up to 16 processor "sockets" to deliver servers with up to 96 processing cores inside, offering tremendous scalability, ample computing threads, extensive memory resources and uncompromising reliability for enterprise data centers. "The arrival of these processors extends Intel's lead in the high-end server segment," said Tom Kilroy, Intel vice president and general manager of the Digital Enterprise Group. "This new processor series helps IT manage increasingly complex enterprise server environments, providing a great opportunity to boost the scalable performance of multi-threaded applications within a stable platform infrastructure. With new features such as additional cores, large shared caches and advanced virtualization technologies, the Xeon® 7400 series delivers record-breaking performance that will lead enterprises into the next wave of virtualization deployments." Several Performance RecordsThe Intel® Xeon® processor 7400 series has already set new four-socket and eight-socket world records on key industry benchmarks for virtualization, database, enterprise resource planning and e-commerce. IBM, following the record-setting 1.2 million tpmC result on its eight-socket System x* 3950 M2 platform, delivers an all-time high result for four-socket servers on System x* 3850 M2 server with a score of 684,508 tpmC on the TPC*-C benchmark, which measures database performance in an online transaction processing environment. An HP ProLiant DL580 G5 server on the SAP-SD benchmark that measures a server's sales and distribution capability on SAP software set a world record with a score of 5155 SD-Users. On the SPECint*_rate2006 benchmark, which measures a system's integer throughput performance, a Fujitsu-Siemens PRIMERGY* RX600 S4 server set a record with a score of 291. Several other records were also set on other key enterprise-related benchmarks. Virtualization Platform of ChoiceBased on Intel's 45nm high-k process technology and reinvented transistors that use a Hafnium-based, high-k metal gate formula, the new Xeon® 7400 series delivers exceptional performance improvements with lower power consumption. This delivers almost 50 percent better performance in some cases, and up to 10 percent reduction in platform power, and has resulted in a world record VMmark (a virtualization benchmark) score for four-socket, 24 processing core servers at 18.49 on a Dell PowerEdge R900 platform using VMware ESX server v3.5.0.* These virtualization performance increases, and advanced virtualization capabilities such as Intel Virtualization Technology (VT) FlexMigration make Xeon® 7400 series-based servers ideal platforms for customers to standardize their virtual infrastructures. FlexMigration enables VM migration from previous-, present- and future-generation Core microarchitecture-based platforms. This ensures investment protection for administrators seeking to establish pools of virtualized systems and using those pools to facilitate failover, disaster recovery, load balancing and optimizing server maintenance and downtime. Product Details, CustomersThese products offer frequencies up to 2.66 GHz and power levels down to 50 watts, including the first 6-core, x86 compatible 65-watt version which translates to just under 11 watts per processor core, with platforms available in rack, tower and highly dense blade form factors. The Xeon® 7400 processor series is compatible with Intel's existing Xeon 7300 series platforms and the Intel® 7300 chipset with memory capacity up to 256GB, allowing IT departments to quickly deploy the new processor into a stable platform infrastructure. Starting today, servers based on the Intel® Xeon® 7400 processor series are expected to be announced by more than 50 system manufacturers around the world, including four-socket rack servers from Dell, Fujitsu, Fujitsu-Siemens, Hitachi, HP, IBM, NEC, Sun, Supermicro and Unisys; four-socket blade servers from Egenera, HP, Sun and NEC; and servers that scale up to 16-sockets from IBM, NEC and Unisys. Many software vendors are also supporting Intel® Xeon® 7400 based platforms with innovative solutions enabling virtualization and scalable performance for the high-end enterprise, including Citrix, IBM, Microsoft, Oracle, Red Hat, SAP and VMware. Pricing for the Xeon® 7000 Sequence processors in quantities of 1,000 ranges from $856 to $2,729. For more details on the Intel® Xeon® 7400 processor series, visit www.intel.com/xeon. For more details on world records and other claims, visit www.intel.com/performance/server/xeon_mp/summary.htmReference : http://www.intel.com/pressroom/archive/releases/20080915comp.htm?cid=rss-90004-c1-212832
Tranquil PC, of the U.K., is taking preorders for a home server based on the dual-core version of Intel's Atom processor that will be available on Sept. 30, but said supply of the system is "very limited." Tranquil's £299 (US$530) T7-HSG server is based on the as-yet unreleased Atom 330, a dual-core chip that was announced at the Intel Developer Forum in San Francisco last month, as part of a new motherboard designed for low-cost desktops. At that time, Intel didn't reveal details of the chip. But Tranquil said the Atom 330 has two 1.6GHz processor cores. Instead of two cores on a single piece of silicon -- like Intel's other dual-core processors -- the chip appears to package two 1.6GHz Atom processors in a single chip, according to a picture posted on Tranquil's corporate blog. This suggests a rushed design. Dual-core processors are far more complicated than simply putting two chips together. These designs are optimized so cores can share the processor's limited memory access most efficiently, and generally include sophisticated power-management systems to reduce power consumption when both cores aren't required. Intel doesn't comment on unreleased products. It wasn't immediately clear how Intel has addressed these issues with the Atom 330, but the chip's design may explain why a mobile version of the dual-core Atom hasn't been announced. Like other Atom systems, the T7-HSG has some hardware constraints relative to systems based on other processors, a strategy adopted by Intel to help segment the PC market and prevent sales of computers based on more expensive Intel chips from being cannibalized. For example, the dual-core Atom motherboard has a single memory card slot that can hold up to 2G bytes of DDR2 memory. Most computers can handle twice that amount with two memory slots. The limited availability of the T7-HSG matches the ongoing shortage of the Atom processor. Demand for Atom has repeatedly surpassed Intel's forecasts and the company has struggled to match the fast-rising popularity of the chip. The production constraint lies in the back-end testing stage of the manufacturing process, where Intel says there is not enough capacity available to meet demand for the low-cost Atom chip. The problem is compounded by the lower selling price of Atom relative to Intel's other products, which generate more revenue for the company and therefore have priority in the testing process। Reference : http://www.pcworld.com/article/150821/intel_atom_dual.html?tk=rss_news
Intel announced four new quad-core Xeon models on Monday that use a halogen-free packaging technology that is easier on the environment. The Quad-Core Xeon L5430, X5470, X5492, and X5270 processors run at clock speeds ranging from 2.66GHz to 3.5GHz and are priced from US$562 to $1,493 each, in 1,000-unit quantities. The 5400-series chips are available immediately and the X5270 will be released in the coming months. Intel did not say where halogen was specifically used in its chips, but it is often used as a flame retardant, including in the resin used in packaging for some chips. Halogen releases dioxins, a family of toxic chemical compounds, into the atmosphere when these chips or other components are disposed of and the resins are burned. Intel is working to use halogen-free packaging for all of its chips, and has previously said it expects to achieve that goal this year. The first halogen-free chips from Intel were the Atom line, released earlier this year. With the announcement of the latest four Xeons, Intel said the same packaging materials will now be used in all of its Xeon server chips. The use of halogen-free packaging marks the latest step in Intel's efforts to curb the environmental impact of its chips। Last year, the company began using lead-free solder with its Penryn family of chips that are produced using a 45-nanometer process. Lead, which is highly toxic, has been the subject of environmental legislation to reduce its use in several markets. Reference : http://www.pcworld.com/article/150772/intel_quad_xeon.html?tk=rss_news
Epson today announced a new multimedia projector, the MovieMate 55. The device includes a projector, CD/DVD player, and speakers in a portable case. The MovieMate 55 offers 16:9 viewing and can project a 60-inch image from 6 feet away from the screen. The projector uses 3LCD technology, and has a white light and color lamp output of 1,200 ANSI lumens. A built-in progressive scan DVD allows you to play DVD movies. You can also connect a iPod using a dock cable and the MovieMate 55's USB port for playing iPod slide shows. The MovieMate 55 has a pair of 8-watt speakers. It also has support for 5.1 Dolby Digital DTS. The projector measures 12।6-by-9.1-by-5 inches and weighs 8.4 pounds. A built-in handle makes it easy to carry the projector, and Epson includes a cushioned case. The price is $700 and comes with a two-year limited warranty and Epson's ExtraCare Home Service. Reference : http://www.macworld.com/article/134951/2008/08/moviemate55.html?lsrc=rss_main
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